Bystronic Inc. (www.bystronic.com) introduced a two-stage pulse piercing method that produces fast and clean cuts on laser cutting systems. In the first stage of controlled pulse pierce, the initial surface is pierced through before switching to a second stage where the intensity of the pulse is increased. In stage two, a cutmonitoring device determines when the pierce-through is achieved before the cutting motion is initiated. The company says this method reduces heat input because of the smaller entry, eliminates material accumulation on the surface of the plate and reduces pierce through times. The technology is standard on the Bystar and Byspeed laser cutting systems.