Pulsed heat thermode technology maintains co-planarity, withstands deformation
A new line of tabletop hot-bar reflow soldering systems are recommended by Miyachi Unitek Corp. for critical assembly operations, like medical devices, cellular phones, on-board computers, LCD monitors, laptops, and cockpit instruments. The Desktop Bonders are capable of reflow soldering, heat seal bonding and/or ACF bonding, hot bar bonding, and heat staking applications.
Miyachi Unitek is a California-based manufacturer of welding equipment and systems, including resistance welding, laser welding, laser marking, laser cutting, and hot-bar reflow soldering and bonding processes. Chris Heesch, the company’s product sales representative, said, “Miyachi Unitek is extremely pleased to offer this series of desktop bonders for customers who want to take the next step from a basic bench system used for producing prototypes.”
The Desktop Bonders use pneumatic bonding heads with the Miyachi’s Quick Connect Blocks and Thermo-plane Thermodes devices. The thermode design offers fast heating and cooling cycles, which reduce process times. Forced air-cooling after the heating process speeds the total bonding process.
The thermode is designed to maintain co-planarity and withstand deformation that tends to occur in some bonding processes. Also, the device experiences no voltage drop feature as current flows from front to back rather than left to right, so there is no damage to the parts during soldering.
The series includes a range of product-handling features to tailor the bonder for use in particular applications, including left-right and front-rear slides, as well as rotary tables. Left-right and rotary models are ideal for higher throughput or higher volume applications, including production of cell phone parts.
Models with in-out slides make it possible to load and unload and visually align parts, with or without a camera. The slide modules operate either manually or pneumatically and have an option for three-stop positions, which is designed for two bonding locations on a single printed circuit board (PCB). This detail is useful for a flex-to-LCD and PCB bonding process.
Additional design options for the desktop series include optical alignment, Kapton feeder, water-cooling, and interposer modules, as well as customized product jigs.
Each model in the Desktop series is connected to and powered by Miyachi Unitek’s Uniflow3 power supply system for pulse-heated, selective soldering, conductive adhesive bonding and thermocompression bonding. Uniflow3 provides targeted heating and precision temperature control for components like flex circuits, ribbon cables, wires, SMT components, single- or dual-sided edge connectors, and thermocompression bonding of gold ribbon.
Heesch added: “With the Uniflow3 power supply acting as the brains of the system, the Desktop Bonders are ideal for joining a wide range of parts and materials.”