Ceramabond 569, a high temperature ceramic adhesive, is now used to bond flexible heaters to quartz reservoirs used in semiconductor processing equipment for high temperature applications. The adhesive is a single part, ceramic-filled paste that bonds to ceramic, metal, and quartz substrates. This compound is rated for operating temperatures to 3,000° F and exhibits a dielectric strength of 200 V per mil. The bond is applied with a brush, syringe, or automatic dispensing equipment. Once applied, curing is accomplished by heating it to 200° F for two hours or drying at room temperature for 24 hours. Cured product exhibits minimal shrinkage and offers mechanical strength, and moisture and thermal shock resistance. Additional applications for Ceramabond 569 include the assembly of igniters, thermocouples, probes, and sensors such as oxygen analyzes, gas chromatographs, mass spectrometers, and high vacuum components. The adhesive is available in pint, quart, gallon, and five gallon pails.

Aremco
www.aremco.com